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http://www.ziemann-urban.de/
We offer turn-key automation with vision systems, semi to fully-automatic Diebonder and Diesorter, Inline Blistertape and Reel-2-Reel inspection.
Keywords: die bonder,
chiptray,
dieattach,
dijector,
epoxy,
inline automation,
substrate attach,
wafer,
die-bonder,
tapefeeder, assembly automation, bga, cob, chip sort, chip sorter, chip tray, die attach, die eject, die ejector, die pack, die packer, die pick and place, die sort, die sorter, die-attach, die-sorter, diebonder, diesorter, diject, dijecter, epoxy die attach, epoxy die bond, epoxy die bonder, fcm, fcm 2080, flexible assembly, flexible automation, flipchip, gel pack, gel-pak, hybrid assembly, hybrid manufacturing, in-line
vision system, in-line automation, industrial applications
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http://www.kinesysinc.com/
Provides software for managing substrate maps for inkless semiconductor fabrication.
Keywords:
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